RoHS:

Advanced Circuitry International certifies all materials used to build parts using a final finish metal of Immersion Tin, ENIG, ENEPIG, Gold, Immersion Silver, Electrolytic Tin and/or Bare Copper is RoHS compliant and do not contain any of the below substances above the maximum concentration values identified in Annex II of the RoHS Directive 2011/65/EU and amendment 2015/863.

1. Lead (Pb) – 0.1 % of weight (1000ppm)
2. Mercury (Hg) – 0.1 % of weight (1000ppm)
3. Hexavalent Chromium (Cr VI) – 0.1 % of weight (1000ppm)
4. Polybrominated Biphenyls (PBB) – 0.1 % of weight (1000ppm)
5. Polybrominated Diphenyl Ethers (PBDE) – 0.1 % of weight (1000ppm)
6. Bis(2-Ethylhexyl) phthalate (DEHP) – 0.1 % of weight (1000ppm)
7. Benzyl butyl phthalate (BBP) – 0.1 % of weight (1000ppm)
8. Dibutyl phthalate (DBP) – 0.1 % of weight (1000ppm)
9. Diisobutyl phthalate (DIBP) – 0.1 % of weight (1000ppm)
10. Cadmium (Cd) – 0.01 % of weight (100 ppm)

REACH:

Under REACH circuit boards are “Articles” as defined in REACH Article 3(3). Articles containing SVHC (Substances of Very High Concern) must be registered if they contain any SVHC in concentrations greater then 0.1% of “Article” weight. This list is specified by the European Union Directive 1907/2006 on the Registration Evaluation Authorization and Restriction of Chemicals of which can be viewed at: echa.europa.eu, None of the current 235 substances as of June 14^th  2023 on the list are found in the products we sell.

Advanced Circuitry International certifies all materials used to build parts using a final finish metal of Immersion Tin, ENIG, ENEPIG, Gold, Immersion Silver, Electrolytic Tin  and/or Bare Copper do not contain any of the listed SVHC’s and are in full compliance of the EU REACH Directive 1907/2006 requirement.

*Advanced Circuitry International is disclosing the above information to the best of our knowledge and based upon data from our raw material suppliers.